Features
• System on a Chip requires minimal external components for reduced bill of materials
• Innovative PHY algorithms and System Software for superior high-speed mobile performance
• Intelligent MAC protocols for high throughput and guaranteed QoS
• Dynamic power management reduces active and standby power
• Multiple interfaces support multiple platforms with a single SoC
• Standard low-cost RF transceivers supported
• Small size and low total BOM cost fits Half-mini Card and other compact formats
• 9 x 9 x 1 mm, 232 ball TFBGA, 65nm design